Ansys 2023 R1 Electronics Highlights

Overview

In the Ansys 2023 R1 release, Ansys Electronics continues to demonstrate its Technology leadership in computational electromagnetics. Improvements in simulation performance, meshing, integrations with other Ansys tools. Automated workflows and modeling capabilities extend Ansys leadership in electromagnetic simulation and computational multiphysics for designing high speed PCBs, electric machines, antennae, radar and other electronic systems.

Ansys 2023 R1 Electronics Release highlights

Ansys HFSS

Layout Component Placement Enhancement in HFSS 3D – Improved workflow to easily place Layout components in HFSS 3D to create extremely complex assemblies in a few minutes.
HFSS Parallel Component Adapt for 3D Component Array – Accelerate finite array simulations by adapting individual 3D component cells of an array in parallel.
Improved HPC performance for distributed mesh fusion solver – Improves hardware utilization and simulation time when mesh fusion is used.

Ansys Icepak w/AEDT

New Meshing Enhancements – stair step meshing (2D multilevel) that captures individual layers and details, resulting in a more robust PCB meshing which functions on both stacked and layered structures. The enhancement is also incorporated into the sliding bar mesh.
Enhanced post processing for thermal fields resulting in a 2-3X speedup in performance over the 22R2 version in Ansys 2023 R1 Electronics release.
Compact Thermal Model (CTM) Version 2 support. This enables code simulation bidirectionally with Redhawk-SC ET when utilizing encrypted TSMC technology. By using Ansys Icepak, users can capture environmental effects (fans/airflow and convection/radiation) and then return this thermal data to RHSC-ET.

Ansys Maxwell – Ansys 2023 R1 Electronics

Induction Machine ROM-based Efficiency Map – by utilizing Reduced Order Modeling (ROM) and including it in the electric machine toolkit, a FEA solution is effectively squeezed down to a circuit simulation, providing a significant simulation performance enhancement.
Performance improvements for quasi-static solvers – this set of enhancements is particularly helpful in PCB simulations where the conduction path includes complex geometry (which inevitably results in a large number of excitations.) In applications such as portable devices, computers, switch mode power supply devices, etc., where multi-layer PCBs allow for much higher component density, fine conductive traces are needed. Enhancements to the quasi-static solvers reduces the CPU time assignment of the magnetic field, with processing that occurs at the beginning of solution reduced from hours to minutes.

Ansys SIWave & Ansys Q3D Extractor

There are a number of SIwave enhancements & new components, including a new DC IR plot display which clarifies IR drops across complex designs.
Q3D solver improvements for power electronics & PCB apps – the distributed computing memory solver for CG extraction can now handle bigger designs and run faster simulations with them. There are also particular benefits to power electronics, as the DC to AC transition region solver for AC RL extraction now has a specific solver for this nonlinear region, resulting in higher accuracy than the previous blended results of the separate DC and AC solvers.

Ansys Motor-CAD

NVH Enhancements – available now for Induction Machines, including transient calculation improvements and across the board performance improvements. Included are improved integrations with Ansys optiSLang, Ansys Mechanical and Ansys Sound to provide further support for NVH analysis and simulation.
Automated workflows with Ansys Discovery, Ansys Mechanical, Ansys Maxwell and Ansys Fluent model export and setup for improved computational Multiphysics support.
The addition of various rotor geometries for use in parameter-driven optimization using Ansys optiSLang.
Multiple improvements in hairpin winding modeling.